| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate cooling apparatus capable of cooling a substrate with high uniformity. SOLUTION: A substrate cooling apparatus includes: a mounting table including a mounting surface for mounting a substrate thereon; a projection provided on the mounting surface and supporting the rear surface of the substrate; a coolant flow passage through which a coolant flows, wherein the coolant flow passage is provided in the mounting table to cool the mounting surface; a plurality of gas discharge ports provided in the circumferential direction at a peripheral edge of the mounting surface and discharging cooling gas for cooling the substrate; a gas suction port provided at the center of the mounting surface to suck the cooling gas; and a groove provided in the mounting surface to diffuse the cooling gas in the circumferential direction of the substrate. The substrate cooling apparatus with such a configuration can cool the substrate mounted on the mounting surface with high uniformity. COPYRIGHT: (C)2011,JPO&INPIT |
