发明名称 Bedienfeldvorrichtung
摘要 <p>A panel device includes a panel section, a first conductive layer that is provided in a side of one surface of the panel section, an insulating layer that is stacked on the first conductive layer and a second conductive layer that is stacked on the insulating layer. The first conductive layer and the second conductive layer are formed by coating an electrically conductive solvent-type substance. The insulating layer is formed by coating an insulating curing-acceleration-type substance.</p>
申请公布号 DE112008003794(T5) 申请公布日期 2011.04.28
申请号 DE20081103794T 申请日期 2008.12.25
申请人 MITSUBISHI JIDOSHA KOGYO K.K.;VISTEON JAPAN LTD. 发明人 YAMAUCHI, KAZUTO;MURAYAMA, YASUNORI;TANAKA, SADAHIKO;TAKIZAWA, KEITARO;YAMANOUE, KOUICHI
分类号 H01H11/00;H01H13/00;H01H13/14;H01H36/00 主分类号 H01H11/00
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