| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric conversion module capable of assuring a heat radiative performance and an endothermic performance, such as to maintain a trouble-free size for an electric wiring work (a wiring work), at mounting of electrodes. SOLUTION: A thermoelectric conversion module 1 includes a thermoelectric semiconductor element 2; an endothermic part insulation property substrate 3b constituting an endothermic part disposed facing each other so as to sandwich the thermoelectric semiconductor element 2; and a heat radiation insulation property substrate 3a constituting the endothermic part; and uses the peltier effect caused by current drawn in the thermoelectric semiconductor element 2 via the endothermic part insulating property substrate 3b and an electric wiring pattern 4 formed on the endothermic part insulating property substrate 3a; and electrical pads 5 for electrically connecting the thermoelectric conversion module 1 and the outside of the thermoelectric conversion module 1 with a surface other than the surface contacting the thermoelectric semiconductor element 2 of either or both of the endothermic part insulating property substrate 3b or the heat radiation part insulating property substrate 3a. COPYRIGHT: (C)2011,JPO&INPIT
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