发明名称
摘要 To provide a radiation-sensitive resin composition having no safety problem, superior in sensitivity, resolution and storage stability as a solution, and having such a proper development margin that a proper pattern profile can be formed, even after the lapse of the optimum developing time in a developing step, and to provide an interlayer insulation film and microlenses formed from the composition. The radiation-sensitive resin composition contains [A] a copolymer of (a1) at least one selected from among unsaturated carboxylic acid and unsaturated carboxylic acid anhydride and (a2) a specific oxetane group-containing unsaturated compound, [B] a 1,2-quinonediazido compound and [C] a thermosensitive acid generating compound.
申请公布号 JP4677871(B2) 申请公布日期 2011.04.27
申请号 JP20050289472 申请日期 2005.10.03
申请人 发明人
分类号 G03F7/023;G03F7/004;G03F7/40;H01L21/027 主分类号 G03F7/023
代理机构 代理人
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