发明名称 Organic electronic devices and methods for manufacturing the same
摘要 <p>The present invention discloses a method for manufacturing an Organic-Electronic (OE) Device. The method comprises providing at least one lower electrode onto a substrate; providing at least one lower organic layer onto the lower electrode; providing at least one upper electrode onto the lower organic layer to obtain an OE stack; providing a glue, providing a cover, and dicing the OE stack into a plurality of OE dies, and providing a plurality of side-contact electrodes on at least one sidewall of the OE dies. A plurality of voltages is respectively applicable to the plurality of side-contacted electrodes such that the plurality of side-contacted electrodes become electrically connected over the at least one organic layer.</p>
申请公布号 EP2315252(A2) 申请公布日期 2011.04.27
申请号 EP20100188468 申请日期 2010.10.22
申请人 CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT 发明人 BEIERLEIN, TILMAN
分类号 H01L27/32;H01L51/56 主分类号 H01L27/32
代理机构 代理人
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