发明名称 |
Connection between a semiconductor housing and a base plate comprising a passage opening for fastening to a heat sink |
摘要 |
A semiconductor module has a housing (2) and a metal base plate (3). A reliable yet easily producible force-transmitting connection between a semiconductor module and an external heat sink is provided by a mechanical pressure-proof counterpart (4) which is incorporated into the housing (2) and forms a firm connection (14) with a pressure-proof connecting element (10) on the base plate side. The connection is provided with a passage opening (12) for fastening the semiconductor module to the heat sink.
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申请公布号 |
US7932598(B2) |
申请公布日期 |
2011.04.26 |
申请号 |
US20050313838 |
申请日期 |
2005.12.20 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
LENNIGER ANDREAS |
分类号 |
H01L23/34;H01L23/12;H01L23/40 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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