| 摘要 |
PROBLEM TO BE SOLVED: To provide an image capture lens module which is mounted at wafer-level. SOLUTION: The image capture lens module includes: a first compound lens having a first lens element, a second lens element, and a third lens element arranged in sequence from an object side to an image side; a second compound lens having a fourth lens element, a fifth lens element, and a sixth lens element arranged in sequence from the object side to the image side; and a cover glass used for an image sensor, positioned behind the second compound lens. COPYRIGHT: (C)2011,JPO&INPIT
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