LAMP ASSEMBLIES AND METHODS OF MAKING THE SAME

摘要

Lamp assemblies and methods of making the same are provided. Such a lamp assembly can include a heat sink and a light-emitting diode package that can be mounted to the heat sink. The light-emitting diode package can include a substrate with a top surface and bottom surface, a lens, and electrical contacts on the surface of the substrate. The lamp assembly can also include a printed circuit board with a face surface, a rear surface opposite the face surface and an opening extending from the face surface to the rear surface. The printed circuit board can have electrical contacts thereon for electrical connection with the electrical contacts of the light-emitting diode package. The substrate of the light-emitting diode package can engage the opening of the printed circuit board to mechanically couple the light-emitting diode package to the printed circuit board. When assembled, a bottom surface of the substrate can be flush and aligned with a rear surface of the printed circuit board.