| 摘要 |
<p>Systems and methods for ALD thin film deposition 200, 300 include a mechanism 280, 380 for removing excess non-chemisorbed precursors from the surface of a substrate 210, 310 in a translation-based process involving multiple separate precursor zones 214, 216, 314, 316. Excess precursor removal mechanisms 280, 380 according to the present disclosure may introduce localized high temperature conditions, high energy conditions, or azeotropes of the excess precursor, to liberate the excess precursor before it reaches a separate precursor zone, thereby inhibiting CVD deposition from occurring without causing heat-induced degradation of the substrate.</p> |
