| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To restrain warpage of a wiring board due to contraction or the like of a resin, in a manufacturing method for providing a plurality of resin-sealed semiconductor devices by resin-sealing a plurality of semiconductor chips mounted on a wiring board, and thereafter dividing the wiring board. <P>SOLUTION: When sealing a plurality of semiconductor chips mounted on the upper surface of a matrix substrate 1B with a resin 14, the resin 14 is divided into a plurality of blocks using a die including a plurality of cavities, whereby warpage of the matrix substrate 1B due to contraction or the like of the resin 14 after a mold process is restrained. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
