| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a die attach film which can prevent the exfoliation of a semiconductor chip, and to manufacture a reliable semiconductor device by reducing a linear expansion coefficient and an elastic modulus of a curing substance, and reducing the generation of stress to a joined semiconductor chip, and to provide a dicing die attach film manufactured using the die attach film. <P>SOLUTION: The die attach film is composed of a curable resin composition containing a curable compound, a curing agent, and polyimide particles. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
