| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board, capable of improving productivity in surface mounting of an electronic component. <P>SOLUTION: The circuit board 1 includes an insulating board 10, where a mounting pad 21 is formed on its surface; an insulating cover layer 30 which is stacked on the insulating board 10, with a first through-hole 33 formed at the position corresponding to the mounting pad 21, and an adhesive layer 40 which is stacked on the insulating cover layer 30, with a second through-hole 41 formed at the position corresponding to the mounting pad 21. The adhesive layer 40 is formed, at least at a part of the portion facing a terminal formation surface 61a of an IC device 60, in the insulating cover layer 30. <P>COPYRIGHT: (C)2011,JPO&INPIT |
