HEAT-DISSIPATION STRUCTURE FOR A MULTILAYER SUBSTRATE

摘要

Disclosed is a heat-dissipation structure for a multilayer substrate. Said heat-dissipation structure is provided with: a multilayer substrate in which conductive layers comprising a conductive material and insulators comprising an insulating material are layered in alternation; heat-generating elements provided on the surface of the multilayer substrate; via holes that are formed around the heat-generating elements and that penetrate all the way through the multilayer substrate in the direction of layering; heat-dissipating lands that are provided on an inner layer of the multilayer structure and that release heat from the heat-generating elements; and a heat-transmitting material that is provided in the via holes and that transmits the heat from the heat-generating elements to the heat-dissipating lands.