| 摘要 |
PROBLEM TO BE SOLVED: To obtain a multilayer printed wiring board for reducing the amount of positional misalignment between an inner via hole filled with conductive paste and an inner layer conductor circuit and an outer layer conductor circuit, and to provide a method of manufacturing the multilayer printed wiring board for improving a yield of a manufacturing process of the multilayer printed wiring board. SOLUTION: A land for X-ray recognition in a layer of a multilayer copper-clad laminate, a conduction hole for X-ray recognition, and an inner via hole for X-ray recognition in a preceding production lot are recognized by X rays. Based on the result, correction is performed to a circuit pattern, a pattern dimension coefficient of the land for X-ray recognition, and a formation position coefficient of a through hole in a succeeding production lot performed after the production of the preceding production lot. COPYRIGHT: (C)2011,JPO&INPIT |
