ELECTRONIC DEVICE AND COMPOSITE ELECTRONIC APPARATUS

摘要

A system board (201) has DIMMs subjected to cooling mounted at DIMM areas (51-1 to 51-6) of a printed circuit board (40). An air-intake hole (61) that brings in cooling air is provided on a side board (41) of the system board (201), and an exhaust hole (62) that discharges the cooling air is provided on a side board (42). The cooling air is sent at a slanted angle relative to the side board (41), and the air-intake hole (61) is provided at a position offset to the cooling air supplying direction side. As a result, cooling air can be directed towards the DIMMs efficiently and cool down the DIMMs.