| 发明名称 |
METHOD FOR BONDING FLIP CHIP AND STRUCTURE AT THE SAME |
| 摘要 |
<p>PURPOSE: A flip chip bonding method and structure thereof are provided to bond a solder bump which has the shortest height using a first resin with first and second electrodes, thereby preventing defective bonding of the solder bump. CONSTITUTION: A first electrode(12) and a second electrode(32) are formed on a first substrate(10) and a second substrate(30) facing each other. A solder bump(14) is formed between the first electrode and the second electrode. The solder bump electrically connects the first electrode with the second electrode. A space ball(42) keeps the gap between the first substrate and the second substrate. The first substrate and the second substrate are bonded by an underfill layer(40).</p> |
| 申请公布号 |
KR20110041181(A) |
申请公布日期 |
2011.04.21 |
| 申请号 |
KR20090098239 |
申请日期 |
2009.10.15 |
| 申请人 |
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
发明人 |
EOM, YONG SUNG;MOON, JONG TAE;CHOI, KWANG SEONG |
| 分类号 |
H01L21/60;H01L23/48 |
主分类号 |
H01L21/60 |
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