| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a metal substrate for bonding that is improved in yield and has stable characteristics; and to provide a light-emitting diode, and a method of manufacturing the light-emitting diode. <P>SOLUTION: The metal substrate for the light-emitting diode is used to manufacture the light-emitting diode including a metal substrate and a compound semiconductor layer, bonded onto the metal substrate via a bonding layer and including a light emission portion. The metal substrate for the light-emitting diode comprises: a metal plate; and metal protective films covering at least an upper surface and a lower surface of the metal plate. <P>COPYRIGHT: (C)2011,JPO&INPIT |
