| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor element that can improve the yield. SOLUTION: The method of manufacturing a semiconductor element includes the steps of forming a first insulation film on a semiconductor substrate; forming a plurality of stepped portions by an etching portion of the first insulation film, forming a conductive layer on the first insulation film, in such a manner as to cover the stepped portions; and etching a portion of the conductive layer that covers the step portions. COPYRIGHT: (C)2011,JPO&INPIT |
