| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package suitable for high-speed processing by preventing malfunction of a circuit. <P>SOLUTION: The semiconductor package includes: a semiconductor chip 11 having an electrode pad 11a on the front surface; a lead frame 12 having a ground pattern 12a for mounting the semiconductor chip 11 thereon and a lead electrode 12b separated from the ground pattern 12a; and a bonding wire 15a for electrically connecting the electrode pad 11a to the lead electrode 12b, wherein, on the ground pattern 12a, a projection member 13 formed of a conductor connected to the ground pattern 12a on the surface on the bonding wire 15a side of a part more projected to the outer periphery than to the region with the semiconductor chip 11 mounted therein is arranged, an insulator 14 having a predetermined thickness is arranged at the top surface of the projection member 13, and the bonding wire 15a is wired directly contacting the insulator 14 on the insulator 14. <P>COPYRIGHT: (C)2011,JPO&INPIT |
