发明名称 COMPOUND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To achieve a highly reliable compound semiconductor device having a stable threshold with a small variation and achieving a sufficient high breakdown voltage even when a gate recess structure is introduced to enable a normally-off operation. <P>SOLUTION: An intermediate layer 5 made of i-AlN is formed between an electron transit layer 3 and an electron supply layer 4, and an opening 11a is formed at a position on a cap structure 7, the position where a gate electrode is to be formed, using the intermediate layer 5 as an etching stopper. Then, an opening 11b is formed at a position positionally aligned with the opening 11a of the intermediate layer 5 by wet etching using a hot phosphoric acid, and a gate electrode 13 is formed so that the lower portion thereof fills an opening 11 comprising the openings 11a and 11b via a gate insulating film 12 and the upper portion thereof projects above the cap structure 7. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011082216(A) 申请公布日期 2011.04.21
申请号 JP20090230877 申请日期 2009.10.02
申请人 FUJITSU LTD 发明人 KANEMURA MASAHITO;YOSHIKAWA SHUNEI
分类号 H01L29/812;H01L21/28;H01L21/306;H01L21/338;H01L29/417;H01L29/778;H01L29/78 主分类号 H01L29/812
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