发明名称 |
Interconnect method for directly connected stacked integrated circuits |
摘要 |
A method and related configuration for stacking and interconnecting multiple identical integrated circuit semiconductor die. A die designed in accordance with the present invention can be directly interconnected with other identical die by placing a second die on a first die. The second die is substantially identical to the first die and has a rotation with respect to the first die. A plurality of electrical interconnections on the first die are contacted with a plurality of electrical interconnections on the second die, forming electrical interconnects between adjacent stacked dies.
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申请公布号 |
US7098541(B2) |
申请公布日期 |
2006.08.29 |
申请号 |
US20030440815 |
申请日期 |
2003.05.19 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
ADELMANN TODD C. |
分类号 |
H01L23/528;H01L25/18;H01L21/56;H01L23/31;H01L23/50;H01L25/065;H01L25/07 |
主分类号 |
H01L23/528 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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