| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for treating a wiring board by roughening the surface of a substrate of copper or a copper alloy having fine wires with a wiring width of 15μm or less thereon to a level having an Ra value of 0.5μm or less with a low etching amount (etching amount of 0.5μm or less) so that the surface can give superior adhesiveness to the fine copper wires with a resin of a resist, an interlayer insulation material or the like. SOLUTION: The method for treating the wiring board includes: treating the surface of the substrate with the first treatment liquid which contains hydrogen peroxide, an inorganic acid such as nitric acid, a halogenous ion and triazole; then treating the surface of the substrate with the second treatment liquid which contains hydrogen peroxide and an inorganic acid; and further treating the surface of the substrate with the third treatment liquid which contains a silane compound. COPYRIGHT: (C)2011,JPO&INPIT
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