发明名称 |
NON-SHRINKING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A method of manufacturing a non-shrinking ceramic substrate according to an aspect of the invention may include: preparing a ceramic laminate having a via electrode therein; firing the ceramic laminate so that a void is formed at the interface between the via electrode and the ceramic laminate; and performing plating to fill the void with a conductive material.
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申请公布号 |
US2011091640(A1) |
申请公布日期 |
2011.04.21 |
申请号 |
US20100973557 |
申请日期 |
2010.12.20 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM JIN WAUN;JEONG SEUNG GYO |
分类号 |
H05K3/10;B05D5/12;H01L21/288 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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