发明名称 |
Bauelement mit einem Halbleiterchip und einem Träger und Fabrikationsverfahren |
摘要 |
A description is given of a method. In one embodiment the method includes providing a semiconductor chip with semiconductor material being exposed at a first surface of the semiconductor chip. The semiconductor chip is placed over a carrier with the first surface facing the carrier. An electrically conductive material is arranged between the semiconductor chip and the carrier. Heat is applied to attach the semiconductor chip to the carrier. |
申请公布号 |
DE102010037439(A1) |
申请公布日期 |
2011.04.21 |
申请号 |
DE20101037439 |
申请日期 |
2010.09.09 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
EDER, HANNES;NIKITIN, IVAN;SCHNEEGANS, MANFRED;GOERLICH, JENS;GUTH, KARSTEN;HEINRICH, ALEXANDER |
分类号 |
H01L21/58;H01L23/12;H05K3/32 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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