发明名称 HERMETICALLY-SEALED BUS MODULE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a compact and inexpensive hermetically-sealed bus module by suppressing temperature increase in a connection unit of a pressure vessel. <P>SOLUTION: The hermetically-sealed bus module includes a plurality of pressure vessels 1 made of a magnetic material, a bus-bar conductor 2 disposed in the pressure vessels, and an insulating spacer 3 that supports the bus-bar conductor 2 and is interposed between the edges 14 of the pressure vessels 1. The pressure vessels 1 are mutually connected by interposing the insulating spacer 3, and are sealed with an insulating gas. A conductive member 16, which has conductivity higher than that of a material forming the pressure vessel 1 and is non-magnetic, is interposed between the edges 14 of the pressure vessels 1 and the insulating spacer 3. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011083099(A) 申请公布日期 2011.04.21
申请号 JP20090232480 申请日期 2009.10.06
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKAHASHI KAZUKI;TSUKIMA MITSURU;ONO YOHEI
分类号 H02G5/06;H02B13/02;H02G5/08 主分类号 H02G5/06
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