发明名称 A MANUFACTURING METHOD OF A HIGH PURITY ELECTROSTATIC CHUCK USING GLASS BONDING PROCESS AND AN ELECTROSTATIC CHUCK USING THE SAME
摘要 PURPOSE: A manufacturing method of a high purity electrostatic chuck using a glass bonding process and an electrostatic chuck using the same are provided to reduce the contamination of a chamber due to the etch on the surface of an electrostatic chuck when being exposed to high density plasma. CONSTITUTION: In a manufacturing method of a high purity electrostatic chuck using a glass bonding process and an electrostatic chuck using the same, an upper plate(100) and a lower plate(110) of high purity are provided. An align hole is formed in the upper and lower plate. A DC hole(130) for supplying power is additionally formed on the lower plate. An electrode(140) is printed on the upper plate. A junction glass is printed on the lower plate. The upper plate and the lower plate are combined.
申请公布号 KR20110040508(A) 申请公布日期 2011.04.20
申请号 KR20090097810 申请日期 2009.10.14
申请人 KOREA SEMI TEK CO., LTD. 发明人 KIM, SUNG HWAN;LEE, DOO RO;KIM, WON IL
分类号 H01L21/687 主分类号 H01L21/687
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