发明名称 |
A MANUFACTURING METHOD OF A HIGH PURITY ELECTROSTATIC CHUCK USING GLASS BONDING PROCESS AND AN ELECTROSTATIC CHUCK USING THE SAME |
摘要 |
PURPOSE: A manufacturing method of a high purity electrostatic chuck using a glass bonding process and an electrostatic chuck using the same are provided to reduce the contamination of a chamber due to the etch on the surface of an electrostatic chuck when being exposed to high density plasma. CONSTITUTION: In a manufacturing method of a high purity electrostatic chuck using a glass bonding process and an electrostatic chuck using the same, an upper plate(100) and a lower plate(110) of high purity are provided. An align hole is formed in the upper and lower plate. A DC hole(130) for supplying power is additionally formed on the lower plate. An electrode(140) is printed on the upper plate. A junction glass is printed on the lower plate. The upper plate and the lower plate are combined.
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申请公布号 |
KR20110040508(A) |
申请公布日期 |
2011.04.20 |
申请号 |
KR20090097810 |
申请日期 |
2009.10.14 |
申请人 |
KOREA SEMI TEK CO., LTD. |
发明人 |
KIM, SUNG HWAN;LEE, DOO RO;KIM, WON IL |
分类号 |
H01L21/687 |
主分类号 |
H01L21/687 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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