| 摘要 |
PURPOSE: A low profile optoelectronic device package is provided to prevent the light from a chip from being discharged between a chip and a metal deposition transparent substrate by including a dam rig to reinforce the adhesion between the chip and the metal deposition transparent substrate. CONSTITUTION: In a low profile optoelectronic device package, a metal deposition transparent substrate(10) comprises a transparent board(11), a window region, and a metal pattern(13). The transparent board comprises a first side and a second side which are opposite to each other. A metal pattern is formed in the edge of one side of the transparent board. A metal pattern comprises at least two internal contact pad(132) and at least one external contact pad(131). At least two internal contact pad are contacted with the two sides of a window region.
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