发明名称 |
CHEMICAL MECHANICAL POLISHING PAD HAVING WAVE-SHAPED GROOVES |
摘要 |
<p>Disclosed is a chemical mechanical polishing pad formed at a polishing surface thereof with a plurality of concentric wave-shaped grooves having different radiuses while having the same shape. Each groove has a desired depth, width, and shape. The chemical mechanical polishing pad provides effects of effectively controlling a flow of slurry during a polishing process, thereby achieving a stability in the polishing process in terms of a polishing rate, and achieving an enhancement in the planarization of a wafer.</p> |
申请公布号 |
EP1433197(B1) |
申请公布日期 |
2011.04.20 |
申请号 |
EP20010965710 |
申请日期 |
2001.08.29 |
申请人 |
SKC CO., LTD. |
发明人 |
PARK, IN-HA;KIM, JAE-SEOK;HWANG, IN-JU;KWON, TAE-KYOUNG |
分类号 |
B24B37/00;H01L21/304;B24B37/04;B24D13/14;H01L21/306 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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