| 摘要 |
PURPOSE: An adhesive composition is provided to improve workability when a semiconductor chip is attached to a printed circuit board and to secure the reliability of the manufactured semiconductor device. CONSTITUTION: An adhesive composition for attaching a semiconductor comprises, based on 100.0 parts by weight of attaching a semiconductor chip, 20~50 parts by weight of caprolactane polydiol having molecular weight of 550~1000represented by chemical formula 1, 20~40 parts by weight of epoxy resin, 5~20 parts by weight of hardener, 0.1~10 parts by weight of curing accelerator, and 5~15 parts by weight of inorganic filler. In chemical formula 1, R is respectively hydrogen or C1-2 alkyl group and n is a mean value of 0-2. |
