| 摘要 |
A substrate clamp ring has an edge exclusion lip with a variable bottom surface. At least a portion of that bottom surface has a height above the substrate contact level selected to minimize accumulation over time of deposited aluminum-copper alloy across lower portions of the bottom surface, and to allow the aluminum-copper alloy to be deposited to a thickness of at least 2 microns on each of a predetermined number of substrates without bridging. The height of the bottom surface at an innermost edge of the lip is preferably about 17 mils, while a height of the bottom surface over the substrate edge is preferably about 8.5 mils.
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