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发明名称
MANUFACTURING METHOD FOR SEMICONDUCTOR CHIP PACKAGE USING UV CURE TYPE ENCAPSULANT
摘要
申请公布号
KR20050100114(A)
申请公布日期
2005.10.18
申请号
KR20040025294
申请日期
2004.04.13
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
LEE, YONG KWAN;HWANG, SEONG DEOK
分类号
H01L23/28;(IPC1-7):H01L23/28
主分类号
H01L23/28
代理机构
代理人
主权项
地址
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