RF POWER AMPLIFIRE COOLING MODULE APPARATUS

摘要

PURPOSE: A high frequency power amplifier cooling module apparatus is provided to efficiently reduce heat by directly cooling a transistor used in an amplifier using refrigerant. CONSTITUTION: A cover(120) is installed on the upper side of an amplifier body(110). A PCB(140) is installed on the upper side of the amplifier. A transistor(150) is assembled with the upper side of the PCB by a fixing member. The body(170) of a cooling device is directly contacted with the upper side of the transistor. A heat radiation fin(180) is installed on the upper side of the body of the cooling device.