发明名称 A CARRIER MEMBER FOR MANUFACTURING A SUBSTRATE AND A METHOD OF MANUFACTURING A SUBSTRATE USING THE SAME
摘要 PURPOSE: A carrier member for manufacturing a substrate and a method of manufacturing a substrate using the same are provided to reduce manufacturing costs for a coreless substrate by applying the carrier member. CONSTITUTION: In a carrier member for manufacturing a substrate and a method of manufacturing a substrate using the same, a first metal layer(110) is laminated to be two stages. An insulating layer(120) is arranged in exposed both sides of the first metal layer. A second metal layer(130) is arranged in exposed both sides of the insulating layer. An adhesive member(200) is formed in the side of the first metal layer. The adhesive member combines the first metal layer.
申请公布号 KR20110039073(A) 申请公布日期 2011.04.15
申请号 KR20090096350 申请日期 2009.10.09
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 BAE, TAE KYUN;SOHN, KEUNG JIN;CHO, SEONG MIN;HONG, HYUUN JUNG;LEE, KYUNG AH;OH, CHANG GUN
分类号 H05K3/00 主分类号 H05K3/00
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