| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a composite member suitable as a heat-dissipating member for a semiconductor element, to provide a process for producing the composite member, and to provide a heat-dissipating member and a semiconductor device. <P>SOLUTION: The composite member includes a complex of magnesium or a magnesium alloy and a non-metal inorganic material such as SiC. The composite member contains SiC in an amount of not less than 50 vol.%, produced by forming a SiC powder compact, sintering the compact to form a SiC assembly having a network that bonds SiC, placing the SiC assembly in a template, and infiltrating molten magnesium or a molten magnesium alloy into the SiC assembly in an environment at an atmospheric pressure or lower. <P>COPYRIGHT: (C)2011,JPO&INPIT |
