| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device of high reliability wherein no breaking or cracking is caused in a semiconductor chip when mounted on a substrate, and to provide an electronic apparatus using the device. <P>SOLUTION: The semiconductor device includes a semiconductor substrate wherein an active layer having a photodetecting portion is formed on its surface, an adhesive layer so provided on the surface of the semiconductor substrate as to surround the photodetecting portion, a light transmitting protective member arranged at predetermined intervals on the photodetecting portion of the semiconductor substrate and bonded across the adhesive layer, and a plurality of external connection terminals arranged on the backside of the semiconductor substrate with the predetermined array. In the external connection terminals positioned on the outermost periphery, center points of connection terminals forming at least facing two sides are arranged in a projecting region of the adhesive layer. <P>COPYRIGHT: (C)2011,JPO&INPIT |
