| 摘要 |
PROBLEM TO BE SOLVED: To provide a micro semiconductor image sensor module for making electronic equipment with an imaging function, such as a digital still camera, a video camera, and a cellular phone with a camera, more compact and lightweight. SOLUTION: The semiconductor image sensor module includes at least a semiconductor image sensor 34 which has a formation region for a means of reading signal charges out on a first principal surface side of a semiconductor substrate and also has a photoelectric conversion region including a second principal surface of the semiconductor substrate as a light incident surface and formed from the first principal surface to the second principal surface, wherein the semiconductor image sensor 34 is fixed on a second substrate 33 so that the second substrate 33 faces the second principal surface of the semiconductor image sensor 34, a support substrate is stuck on a surface of the semiconductor image sensor 34 on the side of the first principal surface, and an electrode pad 45 is formed on a surface of the support substrate to be connected to a conductive plug 56 penetrating the support substrate, thereby electrically connecting the electrode pad 45 and a conductive pattern 411, formed on the second substrate 33, to each other. COPYRIGHT: (C)2011,JPO&INPIT
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