| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board that can have a one surface-side plate-like circuit pattern and an other surface-side plate-like circuit pattern electrically connected to make a large current flow between both the circuit patterns. SOLUTION: In the method of manufacturing the printed wiring board, a top surface-side circuit pattern 20 having a first protrusion 21 and a projection 22 is formed, and a reverse surface-side circuit pattern 40 having a second protrusion 41 is formed. In a state that the projection 22 and a protrusion-side end surface 41a of the second protrusion 41 are inserted into an insertion hole 31 formed at an insulating layer 30 from different directions to abut against each other, the top surface-side circuit pattern 20 and the reverse surface-side circuit pattern 40 are laminated together with the insulating layer 30. Then the projection 22 and the protrusion-side end surface 41a are electrically connected by resistance welding. COPYRIGHT: (C)2011,JPO&INPIT
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