发明名称 METHOD OF BONDING POROUS METAL TO METAL SUBSTRATES
摘要 <p>A method for preparing an implant having a porous metal component. A loose powder mixture including a biocompatible metal powder and a spacing agent is prepared and compressed onto a metal base. After being compressed, the spacing agent is removed, thereby forming a compact including a porous metal structure pressed on the metal base. The compact is sintered, forming a subassembly, which is aligned with a metal substrate portion of an implant. A metallurgical bonding process, such as diffusion bonding, is performed at the interface of the subassembly and the metal substrate to form an implant having a porous metal component.</p>
申请公布号 WO2011044330(A1) 申请公布日期 2011.04.14
申请号 WO2010US51775 申请日期 2010.10.07
申请人 BIOMET MANUFACTURING CORP.;GUPTA, GAUTAM 发明人 GUPTA, GAUTAM
分类号 A61L27/04;A61F2/30;A61L27/54;A61L27/56;B22F3/11;C22C1/08 主分类号 A61L27/04
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