| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an IC device testing socket that exhibits high efficiency of signal transmission in testing of an IC device without decreasing contact pin replacement workability. <P>SOLUTION: A substrate 2 includes layered high dielectrics 22 to 25 laminated on a base 21 made of a dielectric such as glass epoxy resin. Electrically conductive layers such as copper are formed on both sides of each high dielectric. Each contact pin 3 extends substantially perpendicularly to a surface 26 or 27 of the substrate 2 to pass through the substrate 2. The base 21, each high dielectric, and each electrically conductive layer constituting the substrate 2 are formed with through-holes 28 to which each contact pin can be press-fit. An electrically conductive material 281 such as copper is formed on the inner surface of each through-hole 28. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
