SUBSTRATE WITH BUILT-IN FUNCTIONAL ELEMENT, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a structure capable of acquiring sufficient heat dissipation effect while maintaining a thin structure and design flexibility in a substrate with a built-in functional element, and to provide a method of manufacturing the structure.

SOLUTION: A substrate with a built-in functional element includes an insulating layer 3 and one or more functional elements 1 buried in the insulating layer. A heat radiation material 5 arranged around the lateral direction of the functional element 1 inside the insulating layer 3 is exposed from a side surface part of the substrate with a built-in functional element, and at least a part is formed by further extending over the direction perpendicular to the substrate surface (extending part 40).

COPYRIGHT: (C)2011,JPO&INPIT