发明名称 POLYMERIZABLE COMPOSITION, RESIN MOLDING, AND LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a polymerizable composition which has excellent dispersibility of a filler and low viscosity, a crosslinkable resin molding and a crosslinked resin molding which are obtained using the polymerizable composition, and a laminate excellent in electrical properties and peel strength. SOLUTION: The polymerizable composition includes a cycloolefin monomer, a metathesis polymerization catalyst, a crosslinking agent, and the filler contacted beforehand with a dialkoxysilane coupling agent having a crosslinkable carbon-carbon unsaturated bond. The crosslinkable resin molding and the crosslinked resin molding are obtained using the polymerizable composition. The laminate is obtained by layering the crosslinkable resin molding or the crosslinked resin molding at the least. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011074164(A) 申请公布日期 2011.04.14
申请号 JP20090225691 申请日期 2009.09.30
申请人 NIPPON ZEON CO LTD 发明人 MATSUMURA TAKU
分类号 C08G61/08;B32B27/00;C08K9/06;C08L65/00 主分类号 C08G61/08
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