SUBSTRATE MANUFACTURING APPARATUS, SUBSTRATE MANUFACTURING METHOD, SPHERICAL BODY-MOUNTED SUBSTRATE, AND ELECTRONIC COMPONENT-MOUNTED SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To securely prevent excess mounting of a fine spherical body on a substrate.

SOLUTION: A substrate manufacturing apparatus is configured such that it can manufacture a solder ball 300-mounted substrate and has a spherical body mounting apparatus having a solder ball vacuum chucking apparatus 51 including a vacuum chucking head 511 that carries out a vacuum chucking process to vacuum-chuck solder balls 300 at edges of inlets formed in a vacuum chucking surface 512c and that mounts the solder balls 300 vacuum-chucked by the vacuum chucking head 511 on the substrate. The solder ball vacuum chucking apparatus 51 includes a hold vessel 514 that has an opening 514b and holds the solder balls 300, and a vacuum chucking/holding unit 515 that vacuum-chucks and holds the solder balls 300 held in the holding vessel 514 on a front end 515a thereof, and carries out a supplying process that brings the vacuum chucking/holding unit 515 holding the solder balls 300 on the front end 515a and a vacuum chucking surface 512c of the vacuum chucking head 511 relatively close to supply the balls 300 to the vacuum chucking head 511 in a state allowing air to be drawn through the inlets.

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