| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic package for housing a semiconductor element that can prevent the occurrence of the sulfidization discoloration of Ag on a cut surface of a lead terminal where a tie bar is cut away. SOLUTION: In the ceramic package 10 for semiconductor element storage having a lead terminal 12 whose one end is brazed to a metallized film 14 formed on a surface of a ceramic base 11 through a brazing material 13, and the other end protrudes from the ceramic base 11, the ceramic package has notches 17 on both side faces of a part which protrudes from the ceramic base 11 at the lead terminal 12, and a wax pool 18 which has a wax passage of a brazing material 13 spread to the other end side at the lead terminal 12, and in which the thickness of wax generated by the flow of the wax to the notches 17 is thicker than that of the surface of the lead terminal 12, and also thicker than those of both side faces of the lead terminal 12 other than the notches 17. COPYRIGHT: (C)2011,JPO&INPIT
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