发明名称 |
CONDUCTIVE PARTICULATE, ANISOTROPIC CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive particulate with which a high connection reliability can be attained and a connection process of the electrodes can be simplified, and to provide an anisotropic conductive material and a connection structure that are composed by using the conductive particulates. SOLUTION: The conductive particulate has a low melting-point metal layer formed on the surface of a base material particulate, and contains a flux-contained microcapsule enveloping a flux in the low melting-point metal layer, and the content of the flux-contained microcapsules is 0.04-4 vol%. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011076939(A) |
申请公布日期 |
2011.04.14 |
申请号 |
JP20090228720 |
申请日期 |
2009.09.30 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
SASAKI HIROSHI;IWAMOTO MASASHI |
分类号 |
H01B5/00;H01B1/22;H01B5/16;H01R11/01 |
主分类号 |
H01B5/00 |
代理机构 |
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