发明名称 CONDUCTIVE PARTICULATE, ANISOTROPIC CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a conductive particulate with which a high connection reliability can be attained and a connection process of the electrodes can be simplified, and to provide an anisotropic conductive material and a connection structure that are composed by using the conductive particulates. SOLUTION: The conductive particulate has a low melting-point metal layer formed on the surface of a base material particulate, and contains a flux-contained microcapsule enveloping a flux in the low melting-point metal layer, and the content of the flux-contained microcapsules is 0.04-4 vol%. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011076939(A) 申请公布日期 2011.04.14
申请号 JP20090228720 申请日期 2009.09.30
申请人 SEKISUI CHEM CO LTD 发明人 SASAKI HIROSHI;IWAMOTO MASASHI
分类号 H01B5/00;H01B1/22;H01B5/16;H01R11/01 主分类号 H01B5/00
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