| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED package with a reflector, in which light can be efficiently taken out from an LED light emitting element, and to provide a manufacturing method to easily and inexpensively manufacture the LED package. <P>SOLUTION: One or more pad parts 1 loading LED chips 10 and the reflector 3 are formed by applying photoresist (photosensitive resin) to a metal plate, forming a resist pattern by pattern exposure and development processing on the photoresist, and performing etching work using ferric chloride. Silver plating is applied on a recess by etching. The chips 10 are loaded on the pad parts, the lead part and the reflector part. They are wire-bonded and the recess is filled with transparent sealing resin. A transparent resin face is protected after curing and a metal face at the opposite side is etched again so as to form an external connection terminal. <P>COPYRIGHT: (C)2011,JPO&INPIT |
