Disclosed is a semiconductor device wherein an insulation layer has a copper plug in contact with the last wiring layer of the device. There may also be a barrier layer separating the copper plug from the insulation layer. In a further embodiment, there may also be an aluminum layer between the insulation layer and copper plug. Also disclosed is a process for making the semiconductor device.
申请公布号
WO2011043869(A2)
申请公布日期
2011.04.14
申请号
WO2010US46268
申请日期
2010.08.23
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION;FAROOQ, MUKTA, G.;KINSER, EMILY, R.;MELVILLE, IAN, D.;SEMKOW, KRYSTYNA, W.
发明人
FAROOQ, MUKTA, G.;KINSER, EMILY, R.;MELVILLE, IAN, D.;SEMKOW, KRYSTYNA, W.