| 摘要 |
<p>A method for forming a wiring pattern by laser irradiation comprising the steps of coating a light-sensitive material on a substrate 10 to form a light-sensitive layer, irradiating a laser beam on the light-sensitive material of the substrate to form a pattern including an exposed region 31 and an unexposed region 33, and forming a metallic wiring pattern 45 by immersing the substrate 10 into a solution having a plurality of metallic nano-particles; wherein the metallic nano-particles are easily bonded to the straighter molecular structure of the light-sensitive material in the exposed region 31 for forming a conducting wiring pattern 45. Preferably the light-sensitive material is a thiophenyl-azobenzene material, further the laser light is preferably ultra-violet (UV) laser light. The laser irradiation method has advantages such as high-power, high-density, high-directionality and monochromaticity, such that product quality can be effectively controlled. Moreover, the laser irradiated light-sensitive material can form a molecular structure that is easily bonded to the metallic particles. As a result, the chemical wastes are substantially reduced.</p> |
