发明名称 DISCRETE SEMICONDUCTOR DEVICE AND METHOD OF FORMING SEALED TRENCH JUNCTION TERMINATION
摘要 <p>A discrete semiconductor device has a substrate with a first conductivity type of semiconductor material. A first semiconductor layer is formed over the substrate. The first semiconductor layer having the first conductivity type of semiconductor material. A second semiconductor layer over the first semiconductor layer. The second semiconductor layer has a second conductivity type of semiconductor material. A trench is formed through the second semiconductor layer and extends into the second semiconductor layer. The trench has a rounded or polygonal shape and vertical sidewalls. The trench is lined with an insulating layer and filled with an insulating material. A boundary between the first and second semiconductor layers forms a p-n junction. The trench surrounds the p-n junction to terminate the electric field of a voltage imposed on the second semiconductor layer. The discrete semiconductor device can also be a transistor, thyristor, triac, or transient voltage suppressor.</p>
申请公布号 EP2308092(A1) 申请公布日期 2011.04.13
申请号 EP20090803414 申请日期 2009.07.24
申请人 TRION TECHNOLOGY, INC. 发明人 BOWMAN, RONALD, R.
分类号 H01L29/74;H01L21/329;H01L21/331;H01L21/332;H01L29/06;H01L29/732;H01L29/747;H01L29/861 主分类号 H01L29/74
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