| 摘要 |
A method for producing semiconductor chips has the following steps for this purpose: firstly, a semiconductor wafer having a multiplicity of semiconductor chip positions arranged in rows and columns is provided, wherein the semiconductor wafer has on its front side front sides of semiconductor chips with integrated circuits. The rear side of the semiconductor wafer is provided with a coating having Parylene. The semiconductor wafer is subsequently singulated into semiconductor chips having rear sides on which the coating having Parylene is arranged. |
