| 摘要 |
A heat exchange system for electronic devices, preferably data processing devices which include high-performance processors or have a high processor density, includes essentially a primary cooling circuit and a secondary cooling circuit both being thermally associated to the one or more processor units. The secondary cooling circuit is configured as a completely closed system, the coolant in the secondary cooling circuit being driven exclusively by mechanical or inductive coupling with the flow drive of the primary cooling circuit.
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